Semiconductor & Thin Film Coating Division

• Equipment
• Fabrication Tool
• Characterisation Tool
• Packaging Tool

Thin Film Coating

• PECVD/CVD/E-Beam
• ICP/RIE System
• Thermal Evaporator
• Plasma System For - Ashing , Cleaning , Activation , Etching and Coating System
• Equipment Flip Chip Bonder
• Surface Profiler
• Wafer Inspection System
• Various tube & Box Furnaces
• Laser Marking Machine
• LTCC & HTCC Procesing Equipments
• Mask Aligners and Writers
• Wafer Cutting Tool

Wafer Cutting Machine

Flip Chip Bonder

Mask Aligner System

Mask Aligner System

Plasma Cleaner System

Thetametrisis FR-Portable