Packaging Tool

POWATEC wafer mounter Model P-200 allows bonding of films on wafer / substrate and frame in a single pass. The wafer is held by vacuum during the mounting process to an antistatic frits (carbon).

It is a multi-purpose automatic bond test system that can perform various tests simultaneously by installing up to 4 different load cartridges and automatically replacing cartridges within 3 seconds by clicking the program button .

The Die Bonder model PP6 is the most versatile semi-automatic Flip-Chip Platform.Designed for accurate placement of delicate devices on substrate.It achieves high accuracy placement using high quality optical device.

The WB200-e series are designed as a multi-purposes semi automatic wire bond tools for R&D purpose, prototype and small series production.

UniTemp - your partner for all kind of thermal processes We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

Reflow Solder Processes with or without vacuum up to 10-6 hPa. Easy profiling by using a SPS SIMATIC® Controller with WIN based software. Perfect lab tool and also for production on a low cost base. High production output. A remote control can be adjusted and the system can easily integrated into a production line. ● Reflow Solder Processes with flux ● Operation with inert gas, Oxygen, Forming gas, Formic Acid ● Lead and Lead-free SMT reflow ● Resistor paste firing

WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology.

• BONDJET BJ653: WIRE BONDER FOR MANUAL OR AUTOMATIC WIRE BONDING (WEDGE-WEDGE AND BALL-WEDGE)

• BONDJET BJ855: HIGH SPEED FULLY AUTOMATIC FINE WIRE BONDER (WEDGE-WEDGE AND BALL-WEDGE)

• BONDJET BJ955/959: FULLY AUTOMATIC HEAVY WIRE WEDGE-WEDGE BONDER FOR HEAVY WIRE AND RIBBON (AL, ALCU, CU)

• BONDJET BJ931: FULLY AUTOMATIC DUAL-HEAD LEADFRAME WEDGE-WEDGE WIRE BONDER FOR HEAVY WIRE AND RIBBON (AL, ALCU, CU)

• BONDJET BJ985: FULLY AUTOMATIC HEAVY WIRE WEDGE BONDER WITH A LARGE WORKING AREA

• SMART WELDER SW1085: FULLY AUTOMATIC ULTRASONIC WELDER WITH A LARGE WORKING AREA AND ROTATIONAL WELDHEAD

Debut of Flip Chip Bonding system that meets the needs of your production.TDK, an electronic supplier, has completely evaluated the production to find the needs of users and produced this highreliable, space-saving, highspeed equipment for your specific needs.

• Optical Inspection System: During the wafer handling, the system is using the robotic arm to transfer the wafer to/from pre-aligner or inspection chuck. Besides, WIS8000 comes with wafer gripper with the tilting capability for front and back wafer inspection (macro inspection) and high-power microscope with 5 objectives for the micro inspection.

• Post Wire Bond Inspection System: High resolution and speed of vision inspection system, PWB2000 is automated, reliable and effective solution for post die attach and post wire bond inspection. The system comes with the area scanning camera that capable to capture defects by using the 2D vision system. Integrated with programmable dual XY stage and on-the-fly scanning method, the system can accommodate multiple magazines at one time operation and eliminate the waiting time.

• Automated Post Mold Inspection System: PMI3000 is an automated 2D vision inspection system for molded device. It’s come with top and bottom vision inspection capability, by using high resolution camera up to 20MP, lens with 0.5x to 1.3x magnification and illumination. System capable to capture small defect size up to 10x10 micron under 1.3x lens magnification.

• Wafer Thickness & Roughness Measurement System: Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by QES Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height,bow and warp measurements).

• Post Probing Inspection System: The PPI3300 is an ideal solution for detecting defects on 8-inch and 12-inch patterned wafer surfaces such as scratches, ink dot smear, probe marks, water marks, and die edge cracks. High Speed CMOS camera with resolution of 26.1MP & CoaXPress interface is used in the system. The combination of 5120 x 5120 high resolution, high speed at 90 FPS and global shutter create a new standard for the inspection application.

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• T-4909-AE Budget sensitive Manual Die Bonder: The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC.

• T-5100 PC controlled Manual Die Bonder: The T-5100 is the successor of the proven and well known T-3000-M series with many features of the PRO-series. It is an universal workhorse for a wide range of micro-assembly tasks.

• T-5100-W PC controlled Manual Die Bonder - Unique pick-up from wafer: The T-5100-W version features the same flexibility than the T-5100 and has the additional advantage of handling wafers, which sits below the main table with Tresky’s pneumtatic die ejection system.

• T-5300 Manual Bonder with semi auto. process capabilities: Tresky’s T-5300 is the flagship of our Die Bonders and adds a motorized, programmable Z-axis, with our True Vertical Technology™, to the repertoire of the universal T-5100, making it extra useful for repetitive processes in small-scale production, where operator influence must be minimized.

• T-5300-W Manual Bonder with semi auto. process capabilities Wafer Handling capability: The T-5300-W version offers the same flexibility as the T-5300 with the added benefit of being able to handle wafers with Tresky's electric die ejection system, which is located under the main table located. The system has all the basic features to run the most advanced applications in the industry.

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