Semiconductor & Thin Film Coating Division

Packaging Tool

1.WAFER MOUNTER MODEL P-200

POWATEC wafer mounter Model P-200 allows bonding of films on wafer / substrate and frame in a single pass. The wafer is held by vacuum during the mounting process to an antistatic frits (carbon).


2.WIRE PULL & DIE SHEAR TESTER - HAWK 8000M

It is a multi-purpose automatic bond test system that can perform various tests simultaneously by installing up to 4 different load cartridges and automatically replacing cartridges within 3 seconds by clicking the program button .


3.MANUAL & SEMI AUTOMATIC UNIVERSAL FLIP CHIP DIE BONDER

The Die Bonder model PP6 is the most versatile semi-automatic Flip-Chip Platform.Designed for accurate placement of delicate devices on substrate.It achieves high accuracy placement using high quality optical device.


4.MANUAL & SEMI-AUTOMATIC WIRE BONDER

The WB200-e series are designed as a multi-purposes semi automatic wire bond tools for R&D purpose, prototype and small series production.


5.VACUUM REFLOW SOLDERING & RTP SYSTEM

UniTemp - your partner for all kind of thermal processes We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality.

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6.VACUUM REFLOW SOLDER OVEN

Reflow Solder Processes with or without vacuum up to 10-6 hPa. Easy profiling by using a SPS SIMATIC® Controller with WIN based software. Perfect lab tool and also for production on a low cost base. High production output. A remote control can be adjusted and the system can easily integrated into a production line. ● Reflow Solder Processes with flux ● Operation with inert gas, Oxygen, Forming gas, Formic Acid ● Lead and Lead-free SMT reflow ● Resistor paste firing

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7.PACKAGING INSPECTION & METROLOGY

WX3000 3D and 2D metrology and inspection system provides the ultimate combination of high speed, high resolution and high accuracy for wafer-level and advanced packaging applications to improve yields and productivity. Powered by Multi-Reflection Suppression® (MRS®) Sensor Technology.


8.HESSE MECHATRONICS – FULLY AUTOMATIC WIRE BONDER

• BONDJET BJ653: WIRE BONDER FOR MANUAL OR AUTOMATIC WIRE BONDING (WEDGE-WEDGE AND BALL-WEDGE)

• BONDJET BJ855: HIGH SPEED FULLY AUTOMATIC FINE WIRE BONDER (WEDGE-WEDGE AND BALL-WEDGE)

• BONDJET BJ955/959: FULLY AUTOMATIC HEAVY WIRE WEDGE-WEDGE BONDER FOR HEAVY WIRE AND RIBBON (AL, ALCU, CU)

• BONDJET BJ931: FULLY AUTOMATIC DUAL-HEAD LEADFRAME WEDGE-WEDGE WIRE BONDER FOR HEAVY WIRE AND RIBBON (AL, ALCU, CU)

• BONDJET BJ985: FULLY AUTOMATIC HEAVY WIRE WEDGE BONDER WITH A LARGE WORKING AREA

• SMART WELDER SW1085: FULLY AUTOMATIC ULTRASONIC WELDER WITH A LARGE WORKING AREA AND ROTATIONAL WELDHEAD


9.TDK- FULLY AUTOMATIC FLIP CHIP DIE BONDER

Debut of Flip Chip Bonding system that meets the needs of your production.TDK, an electronic supplier, has completely evaluated the production to find the needs of users and produced this highreliable, space-saving, highspeed equipment for your specific needs.


10.QES MECHATRONICS, MALAYSIA

INSPECTION SYSTEMS ( OPTICAL INSPECTION AND POST BOND INSPECTION SYSTEM ) MEASUREMENT SYSTEMS.
(WAFER THICKNESS MEASUREMENT SYSTEM ROBOTIC & HANDLING SYSTEMS )
ROBOTIC & HANDLING EQUIPMENT
WAFER & STRIP HANDLING WAFER PACKING SYSTEM