Semiconductor & Thin Film Coating Division

Fabrication Equipment & Process Tool

1. ATOMIC LAYER DEPOSITION SYSTEMS

Atomic Layer Deposition is an important technique for depositing thin films for a variety of applications. ALD is able to meet the needs for precise thickness control and conformal deposition in high aspect ratio structures to a level that far exceeds other deposition techniques.


2.PLANARGROW GRAPHENE CVD SYSTEM

The planarGROW series of thermal CVD systems for graphene (and CNT growth with minor modifications) is a horizontal hot-wall reactor system.


3.BENCHTOP RIE - PLANARRIE-4B

PlanarRIE is an anisotropic plasma etching system that is designed to deliver optimum performance at low cost with high degree of process repeatability. It can handle wafers up to the size of 100mm (or 4 inches) in diameter.


4.PLANARGROW THERMAL MOS2 CVD SYSTEMS

The planarGROW series of thermal CVD systems for MoS2 (and other metal dichalcogenides) is a horizontal hot-wall reactor system. Unlike graphene, MoS2 is grown from solid sources (typically sulpher powder and MoO3 powder) and can be directly deposited onto a target substrate such as SiO2.


5.PLANARGROW THERMAL H-BN CVD SYSTEMS

The planarGROW series of thermal CVD systems for MoS2 (and other metal dichalcogenides) is a horizontal hot-wall reactor system. Unlike graphene, MoS2 is grown from solid sources (typically sulpher powder and MoO3 powder) and can be directly deposited onto a target substrate such as SiO2.


6.G3 SPIN COATER SERIES

The SCS G3 Spin Coater series sets the standard in operating precision and programming flexibility. It is engineered to provide a high level of rotation accuracy and repeatability, along with precise acceleration and deceleration control.


7.6800 SPIN COATER SERIES

The SCS 6800 Spin Coater Series enables R&D and university laboratories around the world to efficiently and accurately develop and refine coating applications.


8.MULTI-DISPENSE SYSTEM

When more than one material is part of a coating application, one name delivers consistent performance. SCS Multi-Dispense gives you four dispense modules to make the coating application and development process even more efficient.


9.TABLE TOP MASK ALIGNER

Mutech microsystems microAligner is a compact high value UV mask aligner designed for microfabrication applications.It allows for easy fabrication of multilayer devices on a multitude of photoresists, with excellent exposure quality.


10.TABLE TOP LASER WRITER

Mutech microsystems microAligner is a compact high value UV mask aligner designed for microfabrication applications.It allows for easy fabrication of multilayer devices on a multitude of photoresists, with excellent exposure quality.


11.PLASMA CLEANER & ASHER SYSTEMS – DIENER ELECTRONIC GMBH, GERMANY

If energy is continuously supplied to matter, its temperature increases and it changes from the solid to the liquid to the gaseous state. If the energy supply continues, the existing atomic shell is broken open and charged particles (negatively charged electrons and positively charged ions) are formed. This mixture is called plasma or the "fourth state of matter".


12.Low-Pressure PlasmaSystems

  1. ZEPTO STYSTEM: The 2.6 liter LOW-COST PLASMA LABORATORY SYSTEM ZEPTO with manual, PC and PCCE control is mainly used in the following areas:

    small series production, analysis (SEM, TEM), medical technology, sterilization, research and development departments, archaeology, textile technology, plastics technology


  2. ATTO SYSTEM: The 10.5 litre LOW-COST PLASMA LABORATORY SYSTEM ATTO with manual, PC and PCCE control is mainly used in the following areas:

    Small series production, analytics (SEM, TEM), medical technology, sterilization, research and development departments, archaeology, textile technology, plastics technology


  3. FEMTO SYSTEM: The Femto plasma systems can be combined in different variants as in a modular system.The Femto plasma systems are mainly used in the following areas:

    Analytics, archaeology, automotive, research and development departments, semiconductor technology, small series production, plastics technology, medical technology, microsystems technology, sensor technology, sterilization, textile technology


  4. NANO SYSTEM: The Nano plasma systems can be combined in different variants as in a modular system. Below you will find an overview of the most common options in connection with the Nano plasma systems: The Nano plasma systems are mainly used in the following areas:

    Analytics, archaeology, automotive, research and development departments, semiconductor technology, small series production, plastics technology, medical technology, microsystems technology, sensor technology, sterilization, textile technology



13.FULLY AUTOMATIC SINGLE-WAFER PROCESSING – AMC 500

This extremely compact tool for wet processes enables you to make the most of your expensive cleanroom space:

  • Wafer diameters: 2” up to 300 mm or up to 9 x 9”
  • Up to 2 I/O stations for 2” to 200 mm open cassettes or 300 mm FOUP
  • Max. 3 integrated individual chemical supply systems (more possible in external media unit)
  • 1 two-link robot handler with single end effector for low contact handling
  • Outer dimensions L x W: 1215 x 800 mm
  • A separate enclosure of the process area made of resistant material extends the safety features.


    14.THIN FILM DEPOSITION SYSTEMS

    1. SPUTTERING DEPOSITION SYSTEMS: Magnetron sputtering is a versatile technique extensively used for the deposition of a wide range of materials such as insulators, metals, semiconductors. One or more magnetron cathodes of several sizes can be used in a system for deposition of multilayers of different materials or for codeposition.


    2. PECVD DEPOSITION SYSTEMS:
      1) RF Plasma Process Chamber
      • Radio frequency plasma excitation
      • Substrate temperature up to 600 °C
      • Substrate to electrode distance 1-5 cm

      2) MW - PECVD System
      • Microwave plasma excitation
      • Substrate temperature up to 1000 °C
      • Substrate to source distance 1-30 cm
      • Water cooled chamber


    3. ELECTRON BEAM DEPOSITION SYSTEMS: Electron beam evaporation is a well established technique extensively used both in industries and in research laboratories for the deposition of optical materials, metals and semiconductors. Single crucible and multicrucible electron beam sources with power supplies of 6, 10 and 15 kW maximum power are available.


    4. ION BEAM DEPOSITION SYSTEMS:
      1. Ion Beam Source
      2. Rotating TargetAssembly
      3. Dual Ion Beam Sputtering System



    15.LAPPING / POLISHING

    Engis is a global leader in the design and manufacture of complete lapping and polishing systems that offer the highest quality finished components, processed in the quickest cycle times while minimizing manufacturing costs. But the machine is just one part of the process, what really sets us apart from the competition is our unique ability to provide Process Development and Customer Support that is second to none.


    16.WACOM-METAL ORGANIC CVD (MOCVD) SYSTEM

    ・WAFER SIZE: UP TO 8INCH
    ・FOR DEPOSITION OF METAL OXIDE FILM/METAL NITRIDE FILM AND ETC.
    ・CLOGGING FREE VAPORIZER (PATENTED)
    ・POSSIBLE TO USE 4 MOPRECURSORS
    ・SINGLE CHAMBER/DUAL CHAMBER