Semiconductor & Thin Film Coating Division

Characterisation Tool

1. FR – SERIES - THIN FILM THICKNESS MEASUREMENT SYSTEMS

FR-pRo tool is assembled by user selected modules. The Core Unit accommodate the light source, the spectrometer (for any spectral regime in the 200nm- 2500nm range) and the control & communication electronics.


2. PROBE SYSTEMS ( MANUAL, SEMI & AUTOMATIC )

KEY FEATURES

  • Multiple applications with the same system – DC, High Frequency, OPTO, MEMS & more
  • Operates in three modes – automatic ( 24/7), semiautomatic and manual
  • Production & Analytical capabilities
  • Handles 150 and 200 mm wafers & substrates
  • Handles trays of die, wafers or wafers sawn on frames with dual end-effector


    • 3. NANOMEZ™ WL 3500

    KEY FEATURES The WL3500 is an automatic white light interferometry 3D profiler driven by a sub micron resolution XY Linear Motor stage. Designed on the basis of a solid granite tabletop gantry frame structure, it maximizes the stability of the interferometer, which is very sensitive to vibration, and measures the 3D structure and roughness of the 200mm / 300mm wafer surface precisely with the stable suction power of the variable vacuum chuck .


    Email: support@higgsbosonsystems.com