Equipment

  • In- Situ Algnment Wafer Bonding System
  • Four Point Probe Resistivity measurement system
  • Direct Write Lithography System
  • Wafer Grinding , Lapping & Polishing System
  • Acoustic Scanning Microscope for MEMS
  • Thin Film measurement System
  • Wire Bonders
  • Single , Double and IR Mask Aligners
  • Non Contact Depth Measuring Microscope & Zoom Microscope
Wire Bonders
Wafer Cutting Machine
E-Beam & Thermal Evaporator
Thin Film Measurement System
Flip Chip Bonder
Mask Aligner System
Mask Aligner System
Plasma Cleaner System
E Beam Depostion System
Four Point Probe Restivity Measurement System
Mini Vacuum Reflow System
Vacuum Reflow System (VRS-210)
Rapid Thermal Vacuum Process Oven