Materials

  • Sputtering Target
  • Photomasks
  • Silicon Wafer & EPI wafers
  • Various ESD & Clean Room Consumables
  • Epoxies , Adhesives & Sealants for Microelectronics & Industrial Applications
  • Solid Dopant Sources
  • Cearamic Packages & Combo Lid for hybrid & Microwave Semiconductor Devices
  • Au Bonding wire & Ribbon , Al Bonding wire , Cu Bonding wire , Solder Alloy
  • Glass wafer For MEMS
  • Photoresist ( Positive & Negative , E- beam resist)
Solder Alloy
Photoresist
Glass Wafer
Copper Bonding Wires
Email: support@higgsbosonsystems.com